Advanced Semiconductor Packaging Technology and Materials are Key to the AI Era
The high-speed performance of advanced semiconductor chips has become the core driving force of AI technology and applications, and has contributed to the rise of generative AI. The market demand for high-speed computing power and large-scale data processing in generative AI has driven continuous advancement in high-performance computing (HPC) chips and promoted the development of advanced packa...
2024 HLF Summit Introduction: Innovation Ecosystems for Resilient Society
Stephen Su, Senior Vice President of the Industrial Technology Research Institute (ITRI) and as the Co-Chair for the 2024 HLF Summit hosted in Taiwan for the first time, delivered the introductory ...
Advanced Semiconductor Packaging Technology and Materials are Key to the AI Era
The high-speed performance of advanced semiconductor chips has become the core driving force of AI technology and applications, and has contributed to the rise of generative AI. The market demand fo...
24/7 CFE: One of the possible strategic options for Taiwan to achieve net-zero
The latest CCPI (Climate Change Performance Index) results were announced on November 20, 2024, with the top 3 positions left vacant and Taiwan ranking 60th overall. The climate mitigation performa...
