IEKView: Japan’s Strategy amid the Trend of Advanced Packaging
Advanced packaging technology refers to the packaging of multiple chips in horizontal or vertical arrangements to increase overall transistor density. As technology progresses, packaging techniques have evolved from traditional single-chip packaging to advanced packaging that integrates multiple chips for higher transistor density and performance. Compared to traditional packaging, advanced pack...
IEKView: Japan’s Strategy amid the Trend of Advanced Packaging
Advanced packaging technology refers to the packaging of multiple chips in horizontal or vertical arrangements to increase overall transistor density. As technology progresses, packaging techniques ...
The views of SiPh at the SEMICON Taiwan 2024
SEMICON Taiwan 2024 was held at the Taipei Nangang Exhibition Center from September 4 to September 6. This annual event is a major focus for the global semiconductor industry, attracting industry le...
Building Resilient Society with Innovative Technology Solutions
Stephen Su, Senior Vice President of the Industrial Technology Research Institute (ITRI) delivered the presentation of “Building Resilient Society with Innovative Technology Solutions” ...
