Advanced Semiconductor Packaging Technology and Materials are Key to the AI Era

Category：
IEKView
Domain：
IC Devices & Technologies, IC Industry, Upstream Materials for Electronics Industry, Upstream Materials for Electronics Industry, IC Applications & Markets, High frequency application materials
Author：
Date：
2025/04/14
Pages：

Report Outlook

The high-speed performance of advanced semiconductor chips has become the core driving force of AI technology and applications, and has contributed to the rise of generative AI. The market demand for high-speed computing power and large-scale data processing in generative AI has driven continuous advancement in high-performance computing (HPC) chips and promoted the development of advanced packaging technology. 

 

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